반도체 패키지 핵심소재 전문 글로벌 기업 - 엠케이전자 주식회사,PRODUCT

PRODUCT INFO

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  • Solderball
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제품소개 > Solderball

Solderball

제품개요 Solder Ball CCSB

Composition Group

Size Spec.
Item Melting Tempe.(℃) Specific Gravity
Lead-free Low Ag Sn-1Ag-0.1Cu 217 ~ 227 7.3
Sn -1Ag-0.5Cu 217 ~ 227 7.3
Sn -1.2Ag-0.5Cu-0.05Ni 217 ~ 227 7.4
Sn -1.2Ag-0.5Cu-0.05Sb 217 ~ 227 7.3
High Ag Sn-3Ag-0.5Cu 217 ~ 219 7.4
Sn-3Ag-0.5Cu + (0.01Ni + 0.01Ge) 217 ~ 219 7.4
Sn-3Ag-0.5Cu + (0.15In + 0.01Ge) 217 ~ 219 7.4
Sn-3.5Ag 221 7.3
Sn-4Ag-0.5Cu 217 ~ 219 7.4
LTS
(Low Temp. solder)
Sn-Ag-Bi-X 207 7.44

솔더볼의 조성은 고객의 요청에 따라 조정가능합니다.

Effect of each element in Sn-based alloy

Effect of each element in Sn-based alloy
  • Sn
    • Bi
      • Wettability Physical Property
      • Low melting phase Fatigue Property Elongation
    • In
      • Wettability Melting Temp Fatigue property
      • Creep Property Cost Dross
    • Ag.Cu
      • Strength Fatigue property
      • Melting Temp. Intermetallic layer
    • Zn
      • Melting Temp. Cost
      • Dross, Wettability Inert Atomosphere High ativated flux
※ Choice contents of Lead free solder
  • Environmental effect
  • Easy supply of solder alloy
  • Melting temperature (soldering temperature)
  • Electronic & heat conductivity
  • Fatigue properties (mechanical, heat)
  • Usability for present machines
  • Narrow mushy zone
  • Price
  • Suitability

Trend of Solder Ball Composition

Trend of Solder Ball Composition
  1. Sn37Pb
  2. Envirommental problems
  3. Sn3.0~4.0Ag0.5~0.9Cu
  4. Failure by drop shock
  5. Low Ag solder
  1. Sn37Pb
  2. Envirommental problems
  3. Sn3.0~4.0Ag0.5~0.9Cu
  4. Oxidation, Bad wettability
  5. SAC + Ni, Ge, In, Sb etc
※ Compositional trend
  • 1) To enhance the bonding properties ( wettability, oxidation etc. )
  • 2) To improve the reliability (drop shock test etc.)
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