반도체 패키지 핵심소재 전문 글로벌 기업 - 엠케이전자 주식회사,PRODUCT

PRODUCT INFO

  • Bondiing Wire
  • Solderball
  • EVM
  • Target
제품소개 > EVM

EVM

제품개요 EVN
EVM
품목 규격 형태 포장단위 (gr)
Au-Pure (G) G1 Ø1.0 X ℓ40 Wire 100
G2 Ø1.0 X ℓ40 Wire 50
G3 Ø2.0 X ℓ20 Wire 100
G4 Ø1.0 Roll Wire 100
G5 Ø2.0 Roll Wire 100
G6 Ø3~6 Granule 50
G7 Ø2.0 X ℓ10 Wire 100
G8 Ø2.0 X ℓ7 Wire 100
G9 Ø3.0 X ℓ6 Wire 100
G10 Ø2.0 X ℓ3.3 Wire 100
G11 Ø2.0 X ℓ5 Granule 100
Au/Ge/Sb (GGS) FGGS Ø3~6 Granule 500
KGGS Ø3~6 Granule 500
Au/Ge/Ni (GGN) GGN1 Ø2 X ℓ7 Wire 100
GGN2 Ø2 X ℓ7 Wire 100
Au/Ge (GG) GG1 Ø3~6 Granule 500
GG2 Ø3~6 Granule 100
GG3 Ø2 X ℓ7 Wire 100
GG4 Ø3 X ℓ6 Wire 100
GG5 Ø2 X ℓ7 Wire 100
GG6 Ø3~6 Granule 100
GG7 Ø2 X ℓ7 Wire 100
Au/Be (GB) GB1 Ø3~6 Granule 50
GB2 Ø3 X ℓ6 Wire 100
GB3 Ø2 X ℓ7 Wire 100
GB4 Ø1~10 Granule 100
Au/Sb (GSB) GSB1 Ø1.0 X ℓ60 Wire 100
Au/Sn (GSN) GSN1 Ø3~6 Granule 100
GSN2 Ø3 X ℓ6 Wire 100
GSN3 Ø3 X ℓ6 Wire 100
GSN4 Ø2 X ℓ7 Wire 50
GSN5 Ø2 X ℓ7 Wire 100
GSN6 Ø3~6 Granule 100
Au/Zn (GZ) GZ1 Ø1.0 Roll Wire 50
GZ2 Ø3 X ℓ6 Wire 100
GZ3 Ø3 X ℓ6 Wire 100
Au/La (GL) GL1 Ø1~10 Granule 100
EVM
품목 성분 (wt%)
Au Ge Sb Be Sn Zn Ni
Au-Pure (G) G1 99.999
G2
G3
G4
G5
G6
G7
G8
G9
G10
G11
Au/Ge/Sb (GGS) FGGS Bal. 12.0±0.2 0.20±0.02
KGGS 12.0±0.2 (Au+Ge)*0.06
Au/Ge/Ni (GGN) GGN1 Bal. 2.0±0.2 - 3.0±0.2
GGN2 12.0±0.2 - 4.0±0.2
Au/Ge (GG) GG1 Bal. 12.0±0.2 -
GG2 12.0±0.2 -
GG3 12.0±0.2 -
GG4 2.0±0.2 -
GG5 2.0±0.2 -
GG6 15.0±0.2 -
GG7 1.0±0.2 -
Au/Be (GB) GB1 Bal. - 0.98±0.02
GB2 - 1.0±0.2
GB3 - 1.0±0.2
GB4 - 1.0±0.2
Au/Sb (GSB) GSB1 Bal. 0.50±0.02
Au/Sn (GSN) GSN1 Bal. 30.0±0.5
GSN2 20.0±0.5
GSN3 12.0±0.2
GSN4 30.0±0.5
GSN5 20.0±0.5
GSN6 20.0±0.5
Au/Zn (GZ) GZ1 Bal. 5.0±0.2
GZ2 5.0±0.2
GZ3 12.0±0.2
Au/La (GL) GL1 Bal. 1.8+0.2
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