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제품소개 > Bonding Wire

Bonding Wire

제품개요 gold Bonding Wire Ag based wire Advanced Au-Ag-alloy Bonding Wire Copper Bonding Wire

Gold Bonding Wire

Gold Bonding Wire
순도에 따른 분류

재료의 순도에 따라 4N(99.99%), 3N(99.9%), 2N(99%)으로 구분

HAZ 길이에 따른 분류

첨가 원소의 종류와 양에 따라 High loop, Middle loop, Low loop 으로 구분

Classification of Bonding Wire

Classification of Bonding Wire

: Classification by Loop Height → Depends on HAZ Length by gold purity → 2N(99%), 3N(99.9%), 4N(99.99%)

Classification of Bonding Wire
Purity Loop Control Haz Length Wire Type
4N High Long M
Middle Medium T,UB,SUB
Low Short L,XC,UN
3N Low Short UR series
2N Middle Low Short R,LK

와이어 순도에 따른  타입 분류

와이어 순도에 따른  타입 분류
2N (gold 99%) gold bonding wire
  • R : 1% Pd alloy Excellent mechanical property and thermal stability Slow IMC growth due to the Pd barrier effect (high reliability performance)
  • LK : Soft Hardness FAB and Bonded ball Similar bonding parameter window with 4N gold bonding wire Broad IMC coverage Slow IMC growth due to the Pd barrier effect (high reliability performance)
3N (gold 99.9%) gold bonding wire

UR series : Universal application on various PKG Excellent looping formation, high reliability gold bonding wire for green PKG and fine pad PKG’s

4N (gold 99.99%) gold bonding wire
  • M : High loop wire for conventional PKG Soft wire with large grain size
  • L : Middle loop wire for conventional PKG Formation of stable loop height by controlling ball neck grain
  • T : Middle loop wire for long span PKG Stable bondability and loop shape Better toughness and higher yield strength than M, L type
  • UB : High performance wire for fine pad pitch Excellent looping & stable ball forming capabilities
  • SUB : Soft hardness FAB and Bonded ball Robust IMC coverage , Stable IMC growth Superior Uniformity of bonded ball shape
  • XC : Super low loop wire for thin PKG Formation of stable low loop by strengthening on the ball neck
  • UN : Ultra low loop wire High resistance for ball neck damage Excellent resistance to mold sweeping Applied to CSP, MCM, TSOP, Stacked Die PKG

Gold Bonding Wire Products Line-Up

Gold Bonding Wire Products Line-Up

<Wire size : 0.8MIL>

Gold Bonding Wire Products Line-Up
Classification Normal 4N Wire High Performance 4N wire High Tensile Strenght 4N wire High Reliability Wire
4N 3N 2N
Wire Type M L T UB UN UL SUB UR2 LK R
B/L(gr) ≥4.5 ≥5.5 ≥5.5 ≥6.0 ≥6.0 ≥6.0 ≥6.0 ≥6.0 ≥6.0 ≥6.0
B/L(gr) 2-7 2-7 2-7 2-8 2-8 2-8 2-8 2-8 2-8 2-9
HAZ length(um) 200-250 110-140 140-170 100-130 75-95 70-90 100-130 80-100 70-80 120-140
Loop Height(um) Min.180 Min.100 Min.130 Min.70 Min.50 Min.50 Min.70 Min.50 Min.50 Min.80
Loop length(um) Max.150 Max.160 Max.200 Max.200 Max.180 Max.200 Max.180 Max.200 Max.200 Max.200
Application PLCC,DIP,SOJ,SOP TSOP,TQFP QFP,BGA,SBGA QFP,BGA,FPP,CSP QFP,BGA,FPP,CSP CSP,BGA,MCP,LED FPP,Low-k BGA,MCP,Low-k FPP,Low-k BGA,CSP,QFP
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