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Á¦Ç°¼Ò°³ > Bonding Wire

Bonding Wire

Á¦Ç°°³¿ä gold Bonding Wire Ag based wire Advanced Au-Ag-alloy Bonding Wire Copper Bonding Wire

Advanced Au-Ag Bonding Wire (MR/ MRS Type)

Advanced Au-Ag Bonding Wire (MR/ MRS Type)
¸ñÀû ¹× ¿ëµµ (Introduction)
  • »õ·Î¿î ¿ø°¡Àý°¨ Solution
  • ±âÁ¸ Au-Ag wireÀÇ °í½À½Å·Ú¼º (PCT)½ÃÀÇ °è¸éºÎ½Ä ¹®Á¦¸¦ MKE °íÀ¯ÀÇ Çձݼ³°è ±â¼ú·Î¼­ ÇØ°áÇÑ Á¦Ç°
Characteristics as MR Series (Au-Ag wire)
MR Type
Excellent Reliability Good Workability
MRS Type
Excellent Workability Good reliability
Applications

Au-Ag ÇÕ±ÝÀ¸·Î ÀÎÇØ, ³·Àº Àü±âÀüµµµµ¸¦ °¡Áü - nand flash memory PKG µî¿¡ ÀûÇÕ(ex, MCP, FBGA, TSOP, SOIC, QFP, etc,.)

Substitute for Au wire without bonder retrofit

±âÁ¸ bonder ÀÇ Ãß°¡Àåºñ(kit) ¾øÀÌ, air »óÅ¿¡¼­ bonding °¡´É

Enhanced Reliability (PCT : Moisture + Temperature)

Arrest crack inducing oxide growth in IMC with X-element Corrosion generation at interface- Crack development,MR/ MRS type Àû¿ë ½Ã, °í½À½Å·Ú¼º È®º¸°¡´É
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