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제품소개 > Bonding Wire

Bonding Wire

제품개요 gold Bonding Wire Ag based wire Advanced Au-Ag-alloy Bonding Wire Copper Bonding Wire
CopperBonding Wire

CopperBonding Wire

고가의 Au wire를 대체하기 위한 원가 절감형 제품으로, 우수한 전기적 특성과 높은 기계적 강도값을 갖는다.

Wire별 특성 비교
Wire별 특성 비교
items Gold Wire Bare Coopper Wire Pd Coated Copper Wire
Cost of Material Extremely high Lower Low
Market Growth Low High Very high
Gas Environment for Bonding None Forming gas Forming gas or N2 gas
FAB Hardness Low Hard Harder
1st Bonding Robust Narrow window Risk of pad peeling in some weak bond pad
2nd Bonding Robust Weak Better than bare Cu wire
Reliability Better Meet requirement Good
Shelf Life (more than) 1 year 6 months 6 months
Classification Copper Wire
Bare Copper Wire (99.99% Cu)
  • LV type: Fine pad package application Reduced pad damage & short tail problem Enhancement 2nd bond workability
  • CS type: General package application Low hardness & stable 2nd bond
  • CD type: General package application Adopted For SO,TO package
Pd coated Copper wire

PC type: Oxidation stability Workability enhancement (High & stable SPT value) Higher reliability performance

Bare Cu Wire의 단점인 산화 취약성을 개선한 Pd Coated Cu Wire (PC type) Stable Pd Layer

Bare Cu Wire의 단점인 산화 취약성을 개선한 Pd Coated Cu Wire (PC type) Stable Pd Layer
At the coating
Thick wire Dia.
At the product
18um Dia
0.7mil wire

산화 안전성 비교(Floor life comparison in the air after 15 exposed date)

산화 안전성 비교(Floor life comparison in the air after 15 exposed date)
PC type
: 02 thickness < 5A
Bare C/W
: 02 thickness = 200A

Test Method : Auger spectroscopy

Test condition
- Wire size : 0.8mil
- Package : BGA (10,560 bonds)
- Forming gas : 5% H2 + 95% N2
- Gas flow rate : 0.5 liter/min
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