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RESEARCH DEVELOPMENT

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History

History of MKE R&D

1982~2014

²÷ÀÓ¾ø´Â µµÀü°ú ³ë·ÂÀ¸·Î ¹ÝµµÃ¼½ÃÀåÀÇ ¹Ì·¡¸¦ ¸¸µé¾î°©´Ï´Ù

±Û·Î¹ú±â¾÷À¸·ÎÀÇ µµ¾à & ¹Ì·¡¼ºÀ嵿·Â È®º¸
  • 2009
    • 12.5um Gold wire ¾ç»ê
    • New Copper wire °³¹ß (LVS type)
    • ¼¼°è ÃÖÃÊ Ag wire ¾ç»ê ±â¼ú È®º¸
    • 100um ÀÌÇÏ Solder ball ¾ç»ê Àåºñ °³¹ß
  • 2008
    • ½Å±â¼ú ÀÎÁõ(NET) ¸¶Å© ȹµæ (±ÝÀº ÇÕ±Ý º»µù¿ÍÀ̾î Á¦Á¶±â¼ú)
    • ¼¼°è ÃÖÃÊ ±ÝÀº º»µù¿ÍÀÌ¾î ¾ç»ê °³½Ã (MR type)
    • Copper wire Àü¿ë »ý»ê °øÀå ±¸Ãà
    • ÀúÀ¶Á¡ Solder ball °³¹ß (180~190¡É)
Á¦Ç° °³¹ß ¹× ±â¼úÁÖµµ
  • 2007
    • 65nm Low-K¿ë 18um Gold wire Àû¿ë
    • Copper Wire °í°´ ½ÂÀΠȹµæ (Amkor)
    • Pb-free Solder Á¶¼º ƯÇã ȹµæ
  • 2006
    • New 4N, 2N Gold wire °³¹ß (LK, SUB type)
    • New Copper Wire °³¹ß (LV type)
    • Copper Wire °í°´½ÂÀΠȹµæ (STM, AUK)
    • 15um ¾ç»ê Àåºñ °³¹ß, Àåºñ ±¹»êÈ­ ¿Ï·á
  • 2005
    • Copper Wire °í°´ ½ÂÀΠȹµæ ¹× ¾ç»ê°³½Ã(Fairchild)
º¯È­¿Í Çõ½Å ±¹³»½ÃÀå ¸®´õ
  • 2004
    • ¼¼°è ÃÖÃÊ 3N Gold wire¸¦ ¹«¿¬ Green PKG¿¡ Àû¿ë
    • Copper Wire °í°´ ½ÂÀΠȹµæ ¹× ¾ç»ê°³½Ã(Fairchild, Toshiba)
    • °í ½Å·Ú¼º 3N °³¹ß (UR type)
  • 2003
    • °í ½Å·Ú¼º 3N °³¹ß (UR type)
    • 18um Gold wire ³³Ç° ½ÃÀÛ ¹×15um ¾ç»ê Àåºñ °³¹ß
  • 2002
    • PBGA and CSP¿¡ 4N °í°­µµ Gold wire Àû¿ë
    • °í°´ ½ÂÀΠȹµæ
    • 4N °í°­µµ Gold Wire °³¹ß (XC, UB)
  • 2001
    • ¼Ö´õº¼ Á¦Á¶ ¹æ¹ý ¹× Àåºñ ƯÇã ȹµæ
  • 2000
    • Pd barrier È¿°ú ÀÔÁõ : 2N wireÀÇ °í½Å·Ú¼º ¸ÞÄ«´ÏÁò ±Ô¸í
    • Micro Solder Ball °³¹ß
    • Pb-free Solder Ball °³¹ß
¿¬±¸±â¹Ý ±¸Ãà
  • 1999
    • 762um Solder Ball ¾ç»ê °³½Ã
    • Copper Bonding Wire °³¹ß (CD Type)
  • 1998
    • Solder Ball (762um)°³¹ß ¹× Amkor ½ÂÀΠȹµæ
    • ¼¼°è ÃÖÃÊ·Î 2N Gold wire¸¦ BGA PKG¿¡ Àû¿ë
  • 1997
    • 2N Gold Bonding Wire (R type) °³¹ß
    • Soft 4N Gold Bonding wire
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