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History of MKE R&D
1982~2014
²÷ÀÓ¾ø´Â µµÀü°ú ³ë·ÂÀ¸·Î ¹ÝµµÃ¼½ÃÀåÀÇ ¹Ì·¡¸¦ ¸¸µé¾î°©´Ï´Ù
±Û·Î¹ú±â¾÷À¸·ÎÀÇ µµ¾à & ¹Ì·¡¼ºÀ嵿·Â È®º¸
2009
12.5um Gold wire ¾ç»ê
New Copper wire °³¹ß (LVS type)
¼¼°è ÃÖÃÊ Ag wire ¾ç»ê ±â¼ú È®º¸
100um ÀÌÇÏ Solder ball ¾ç»ê Àåºñ °³¹ß
2008
½Å±â¼ú ÀÎÁõ(NET) ¸¶Å© ȹµæ (±ÝÀº ÇÕ±Ý º»µù¿ÍÀ̾î Á¦Á¶±â¼ú)
¼¼°è ÃÖÃÊ ±ÝÀº º»µù¿ÍÀÌ¾î ¾ç»ê °³½Ã (MR type)
Copper wire Àü¿ë »ý»ê °øÀå ±¸Ãà
ÀúÀ¶Á¡ Solder ball °³¹ß (180~190¡É)
Á¦Ç° °³¹ß ¹× ±â¼úÁÖµµ
2007
65nm Low-K¿ë 18um Gold wire Àû¿ë
Copper Wire °í°´ ½ÂÀΠȹµæ (Amkor)
Pb-free Solder Á¶¼º ƯÇã ȹµæ
2006
New 4N, 2N Gold wire °³¹ß (LK, SUB type)
New Copper Wire °³¹ß (LV type)
Copper Wire °í°´½ÂÀΠȹµæ (STM, AUK)
15um ¾ç»ê Àåºñ °³¹ß, Àåºñ ±¹»êÈ ¿Ï·á
2005
Copper Wire °í°´ ½ÂÀΠȹµæ ¹× ¾ç»ê°³½Ã(Fairchild)
º¯È¿Í Çõ½Å ±¹³»½ÃÀå ¸®´õ
2004
¼¼°è ÃÖÃÊ 3N Gold wire¸¦ ¹«¿¬ Green PKG¿¡ Àû¿ë
Copper Wire °í°´ ½ÂÀΠȹµæ ¹× ¾ç»ê°³½Ã(Fairchild, Toshiba)
°í ½Å·Ú¼º 3N °³¹ß (UR type)
2003
°í ½Å·Ú¼º 3N °³¹ß (UR type)
18um Gold wire ³³Ç° ½ÃÀÛ ¹×15um ¾ç»ê Àåºñ °³¹ß
2002
PBGA and CSP¿¡ 4N °í°µµ Gold wire Àû¿ë
°í°´ ½ÂÀΠȹµæ
4N °í°µµ Gold Wire °³¹ß (XC, UB)
2001
¼Ö´õº¼ Á¦Á¶ ¹æ¹ý ¹× Àåºñ ƯÇã ȹµæ
2000
Pd barrier È¿°ú ÀÔÁõ : 2N wireÀÇ °í½Å·Ú¼º ¸ÞÄ«´ÏÁò ±Ô¸í
Micro Solder Ball °³¹ß
Pb-free Solder Ball °³¹ß
¿¬±¸±â¹Ý ±¸Ãà
1999
762um Solder Ball ¾ç»ê °³½Ã
Copper Bonding Wire °³¹ß (CD Type)
1998
Solder Ball (762um)°³¹ß ¹× Amkor ½ÂÀΠȹµæ
¼¼°è ÃÖÃÊ·Î 2N Gold wire¸¦ BGA PKG¿¡ Àû¿ë
1997
2N Gold Bonding Wire (R type) °³¹ß
Soft 4N Gold Bonding wire
History of MKE R&D
1982~2014
²÷ÀÓ¾ø´Â µµÀü°ú ³ë·ÂÀ¸·Î ¹ÝµµÃ¼½ÃÀåÀÇ ¹Ì·¡¸¦ ¸¸µé¾î°©´Ï´Ù
±Û·Î¹ú±â¾÷À¸·ÎÀÇ µµ¾à & ¹Ì·¡¼ºÀ嵿·Â È®º¸
Á¦Ç° °³¹ß ¹× ±â¼úÁÖµµ
º¯È¿Í Çõ½Å ±¹³»½ÃÀå ¸®´õ
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