반도체 패키지 핵심소재 전문 글로벌 기업 - 엠케이전자 주식회사,research & development

RESEARCH DEVELOPMENT

연구개발 > Capability

Capability

Testing Equipment

  • Wire Bonding & Test
    • tttt
    • Bond Tester
    • Plasma Cleaning System
  • Solder Ball & Soldering Test
    • Reflow Machine
    • Zone Shear Tester
    • Wetting Balance Tester
    • High Speed Shear/Pull Tester
  • Reliability Test
    • HAST (Highly Accelerated Stress Test)
    • T/C Test (Temperature Cycle Test)
    • HTST (High Temperature Storage Test)

Analysis Equipment

  • Micro-structure Analysis
    • FE-SEM
    • SEM & EDS
    • Metallurgical Microscope
    • Polishing System
  • Chemical Composition Analysis
    • ICP-OES
    • Spark Emission
    • Wet Analysis System
    • Oxygen Analysis System
  • Material Property Measurement System
    • High Temperature Tensile Strength Tester
    • Micro-Vickers Hardness Tester
    • Electrical Property Measuring System
    • DSC : Phase Change & Melting Temp. Check

Outsourcing Equipment

  • Surface Analysis System
    • FIB (Focused Ion Beam) System
    • TEM (Transmission Electron Microscopy)
    • STEM (Scanning Transmission Electron Microscope)
    • AES (Auger Electron Spectroscope)
    • EPMA (Electron Probe Micro Analysis)
    • SIMS (Secondary Ion Mass Spectrometry)
    • TOC (Total Organic Carbon)
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